__

Tin (Sn)

1. Physical character:

Atomic Weight: 118.71

Electronegative: 1.96

Density: 7.310g·cm−3

Melting Point: 231.93℃

Boiling Point: 2602℃

2. Specification:

Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of Ag, Al, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Pb & Zn is below 10 ppm.

Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni & Zn is below 1 ppm.

3. Physical Size:

Rod, Ingot, Powder

4. Application:

It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.

5. Packing:

Vacuum packaging